Hisense steps up investment in AI and smart TV chips by setting up a joint company
Hisense joined hands with Qingdao Microelectronics Innovation Center Co., Ltd. to establish a chip company with a combined investment of 0.5 billion Yuan on June 28 2019. The new company will work on the R&D of SoC and AI. Hisense has been devoted to the development of chips for long with the...
Nidec Completes Acquisition of Embraco, Whirlpool Corporation’s Compressor Business
Nidec Corporation announced that the Company completed the acquisition of the compressor business of Whirlpool Corporationon July 2, 2019 (July 1, 2019 local time in Brazil) following the European Commission’s approval granted on June 26, 2019.
BSH breaks ground on new dryer and washing machine facility
BSH breaks ground on its first China-based dryer and washing machine facility in Chuzhou on May 8, 2019. With an initial size of 60, 000 square meters and total investment of 1.69 billion Yuan, the facility is scheduled to go into production starting the first quarter of 2021 with a planned annual...
Konka to Build USD4.4 Billion Microchip Base in Chongqing
Chinese home appliance giant Konka Group plans to build a CNY30 billion (USD4.4 billion) semiconductor and photoelectric hub in the megacity of Chongqing with investment of up to CNY7.5 billion in the project's first phase...
Xiaomi sets up its white goods division
Xiaomi group announced its plan of establishing a white goods division to step up its deployment in major home appliances on May 17, 2019. This comes after the company unveiled its dual core strategy of Smartphone & AIoT (AI +IoT) at its annual party in January 2019. Wang Chuan, the newly appointed ...
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